Semiconductor Components
| Manufacturing of Semiconductor IC Heat Sinks and Lead-frame of Diodes | ||
| Heat sinks are made with stamping or drawing to meet customers’ outline requirements, with surface finished with Kenly’s plating facilities and finishing methods such as sand blasting, rack plating and continuous plating to fulfill customer needs. Based on customer requirements on the surface finish of heat sinks, Kenly performs 100% manual inspection to ensure each of the heat sinks satisfies customer utilization, enabling higher yield for the product process and better competitiveness for the customer. | ||
 IC Heat Sink |
Transistor frame |
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| Diode frame |
CU Clip |
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