EMC Molding Technology
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EMC (Epoxy Molding Compound) is an Epoxy compound used for the packaging of highly integrated semiconductor devices. |
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EMC features high heat durability, UV resistant, high integrity, high current, and compact in volume. |
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Under prerequisites of high integrity, low lumen-cost and high reliability, EMC has been developed with IC-industry features for applications in medium and high power LED products. |
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Growth of the LED lighting market or the year is expected to double; the market of large-size backlight products also has room for a 36% expansion. As for the PPA plastic, although it has the lowest price, due to bottleneck issues such as prone to turning yellow, short service life and low reliability, it is no longer preferred by the lighting market and large-size backlight market. |
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Now the EMC LED, featuring excellent heat conductance and anti-yellow properties in combination with the expectation of large-scale price-down has gradually taking place of thermoplastics (PPA) in the lighting and large-size backlight module markets. For the time being, EMC LED modules are all suitable for 1-3W LED packaging processes of medium to high power applications. This also enables EMC LED products to replace ceramic lighting products under the power of 3W and become the mainstream product in the medium- and high-power markets. In the future, market demand will surely increase dramatically. Market expectation shows that EMC products will quickly replace ceramic products in the 1-3W medium- and high-power markets. |
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